CALL FOR PAPERS

CALL FOR PAPERS

Engineering Heat Dissipation for High-Heat-Flux Electronics and AI Data Centers

Submission Deadline: 01 June 2027

Background

The rapid growth of artificial intelligence (AI), high-performance computing, cloud computing, and hyperscale data centers has created significant challenges in heat dissipation and thermal management. Modern GPUs, AI accelerators, and advanced CPUs generate increasingly concentrated heat within compact electronic packages. As chip-level power densities rise, conventional air-cooling systems face growing limitations in removing heat effectively while maintaining acceptable operating temperatures, energy efficiency, and system reliability.

The original source for this call reports chip-level power densities exceeding “60–1,00 W/cm²” and beyond. This figure requires verification because its numerical range is ambiguous. The source also identifies local heat fluxes on the order of 50–150 W/cm² for advanced high-power computing architectures, including the NVIDIA GB200 platform, which combines two GPUs and one CPU with a reported total thermal design power (TDP) approaching 2.7 kW.

These high heat loads create complex thermal and fluid-flow challenges, including non-uniform and transient heat flux distributions, high thermal resistance, large temperature gradients, thermomechanical deformation of cooling components, excessive pressure drops, flow maldistribution, and instability in two-phase cooling systems. Addressing these problems requires advances in heat transfer, fluid mechanics, cooling-system design, thermal materials, and experimental and computational methods.

Mechanical engineering plays a central role in developing effective heat-dissipation technologies. Current approaches include direct liquid cooling, cold-plate systems, microchannel heat sinks, vapor chambers, heat pipes, two-phase cooling, and immersion cooling. At the system level, coolant distribution units, liquid-to-liquid heat exchangers, and warm-water cooling configurations offer additional opportunities to improve heat removal and reduce cooling energy requirements.

Aim and Scope

Jurnal Mesin Elektro Sipil (MESIL) invites researchers, academics, engineers, and practitioners to submit original research articles, review articles, and other relevant scholarly contributions addressing heat dissipation and thermal management for high-heat-flux electronic devices and AI data center infrastructure.

This call emphasizes the mechanical engineering aspects of heat removal, particularly heat transfer, fluid flow, thermal-hydraulic performance, cooling-device design, thermomechanical reliability, computational modeling, experimental investigation, and cooling-system optimization.

Research should provide a clear scientific or engineering contribution to the understanding, design, evaluation, or improvement of heat-dissipation systems. Studies on electronic cooling and data center applications are particularly encouraged when they address fundamental or applied mechanical engineering problems.

Topics of Interest

Topics of interest include, but are not limited to:

High-Heat-Flux Heat Dissipation: Heat removal from high-power CPUs, GPUs, AI accelerators, and other electronic devices operating under high and non-uniform heat fluxes.

Advanced Heat Transfer: Convective heat transfer, conduction enhancement, transient heat transfer, conjugate heat transfer, thermal resistance reduction, and temperature uniformity.

Liquid Cooling Technologies: Direct liquid cooling, cold plates, microchannel heat sinks, liquid-cooled heat exchangers, coolant selection, and cooling-channel design.

Two-Phase Cooling and Boiling Heat Transfer: Flow boiling, evaporation, condensation, two-phase heat transfer, critical heat flux, flow instability, and pressure-drop management.

Heat Pipes and Vapor Chambers: Passive heat-transfer devices, thermal spreading, heat-pipe performance, vapor-chamber design, and hybrid heat-dissipation systems.

Thermal Materials and Interface Engineering: High-thermal-conductivity materials, thermal interface materials, surface modification, contact resistance, and thermomechanical compatibility.

Fluid Mechanics and Thermal-Hydraulic Optimization: Flow distribution, pressure losses, channel geometry, pumping power, flow maldistribution, and optimization of cooling performance.

Computational and Numerical Heat Transfer: Computational fluid dynamics (CFD), numerical heat-transfer modeling, multiphysics simulation, physics-informed optimization, surrogate modeling, and machine-learning-assisted cooling design.

Experimental Heat Transfer and Cooling-System Validation: Laboratory investigations, prototype development, temperature and heat-flux measurement, thermal characterization, and model validation.

Thermal Management for Data Center Infrastructure: Liquid-to-liquid heat exchangers, coolant distribution systems, immersion cooling, warm-water cooling, heat recovery, and energy-efficient heat rejection.

Thermomechanical Reliability of Cooling Systems: Thermal stresses, component warpage, thermal cycling, contact degradation, and reliability under high and transient thermal loads.

Energy-Efficient and Sustainable Heat Rejection: Cooling-system energy consumption, pumping requirements, heat recovery, coolant reuse, and reduction of the environmental impact of thermal management systems.

Contributions that combine theoretical analysis, numerical simulation, experimental validation, and practical engineering applications are particularly encouraged. Studies that identify the trade-offs between heat-transfer enhancement, pressure drop, pumping power, reliability, and overall cooling efficiency are also welcome.

Manuscript Types and Submission Requirements

MESIL welcomes original research articles, review articles, short communications, technical notes, and relevant engineering case studies, subject to editorial assessment and suitability for the journal.

Manuscripts may be written in Bahasa Indonesia or English. Abstracts must be provided in both Bahasa Indonesia and English. All manuscripts must follow the official MESIL Author Guidelines and manuscript template.

Submitted manuscripts must be original, must not have been published previously, and must not be under consideration for publication by another journal. All submissions are subject to an initial editorial assessment and peer review in accordance with MESIL's editorial policies. Submission does not guarantee acceptance.

Submission Deadline

01 November 2026

Authors should submit their manuscripts through the official online submission system of Jurnal MESIL:

https://jurnal.ceredindonesia.or.id/index.php/mesil

Authors are encouraged to consult the journal's current author guidelines, submission procedures, and publication fee information before submitting their manuscripts.

Keywords

Heat Dissipation; High-Heat-Flux Cooling; Heat Transfer; Electronic Cooling; Liquid Cooling; Two-Phase Cooling; Thermal-Hydraulic Performance; Heat Sink Design; Computational Fluid Dynamics; AI Data Centers.